Celestica, a world leader in design, manufacturing, supply chain, and platform solutions, announced two new 1.6TbE data center switches DS6000 and DS6001 designed to address the high-bandwidth requirements of artificial intelligence (AI) and machine learning (ML) applications.
Improved Performance and Scalability
The DS6000 is a 3RU, 64-port x 1.6TbE traditional air-cooled data center switch. The DS6001 is a 2U hybrid-cooled switch. They designed it for 21-inch OCP ORv3 racks. This switch uses both air and liquid cooling. This setup allows for high-density deployments. This setup supports high-density deployments. Both platforms feature the Broadcom Tomahawk 6 (TH6) chipset. It offers up to 102.4 Tbps of switching capacity.
AI-Optimized Networking Features
Celestica’s new switches provide a full range of AI routing capabilities and interconnect choices, engineered to address the requirements of AI clusters.
Open Networking Ecosystem Integration
DS6000 and DS6001 both offer an open-source Network Operating System (NOS) solution via the integration of Celestica Solutions for SONiC and other distributions of SONiC. Such an open-source, supported, and validated NOS allows production-ready deployment across a variety of use cases ranging from the data center out to the edge.
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Industry Recognition and Future Prospects
Celestica will donate the DS6000/DS6001 specifications to the OCP Community and publish them on the OCP Marketplace with OCP Inspired™ recognition.
Supporting Quotes
The launch of our new 1.6T switches is a major milestone for Celestica and our customers. The DS6000 and DS6001 signify the next generation of high-performance networking, quadrupling the switching capacity of our existing products and engineered specifically to address the needs of AI/ML cluster applications,” comments Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering, Celestica. We’re glad to highlight these innovations at OCP Global Summit, reaffirming our leadership of the open networking ecosystem.”
“We’re excited to see Celestica leverage the capabilities of our new Tomahawk 6 chipset to deliver these transformative switches to the market. Tomahawk 6 offers incredible switching density, optimized to address the high-bandwidth and low-latency requirements of today’s AI/ML workloads.”. With Cognitive Routing 2.0 capabilities and support for both scale-up and scale-out network topologies, this chipset is designed to drive the next generation of huge AI clusters. Celestica’s latest DS6000 and hybrid-cooled DS6001 switches reflect the possibility of innovation when we work together to create solutions optimised for the AI age,” states Ram Velaga, Senior Vice President and General Manager, Core Switching Group, Broadcom.
“Celestica’s launch of these new 1.6T switches is a strong extension of their established leadership in high-speed and AI networking. Having received the 2024 Dell’Oro Market Share Leader Awards for Ethernet Switch – AI Networks and High-Speed Networks (> 800 G), Celestica has already demonstrated that they can deliver the phenomenal demand for AI infrastructure,” says Sameh Boujelbene, Vice President of Research at Dell’Oro Group.