Flex has teamed up with LG Electronics (LG) to create modular cooling solutions. This partnership addresses the growing thermal management demands of AI-driven, high-density data centers. Flex will use its skills in liquid cooling, power, and IT infrastructure. Meanwhile, LG will offer its advanced air and liquid cooling technologies. Together, they will offer prefabricated, scalable data center systems. These systems will improve efficiency, simplify deployment, and speed up revenue generation. “Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center,” said Michael Hartung, president and chief commercial officer, Flex.
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The joint solutions will include advanced chiller systems, coolant distribution units (CDUs), and secondary fluid networks (SFNs) to optimize energy use and maintain reliable temperature control for intensive AI workloads. “We are advancing our competitiveness in the AI data center market by strategically partnering with leading global companies,” added James Lee, president of the LG ES Company. The partnership expands both companies’ global reach, reinforcing their positions as key enablers of the next generation of sustainable, high-performance AI infrastructure.