Introducing the IBM Telum II Processor and IBM Spyre Accelerator to Enhance Enterprise AI, Supporting Large Language Models and Generative AI
Advanced I/O technology supports a scalable I/O subsystem aimed at reducing energy use and minimizing data center footprint.
At Hot Chips 2024, IBM shared the architectural features of the upcoming IBM Telum® II Processor and IBM Spyre™ Accelerator. These new technologies are set to expand processing capacity in next-generation IBM Z mainframe systems, facilitating the integration of traditional AI models and Large Language Models (LLMs) through a novel ensemble AI approach.
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As generative AI projects using LLMs transition from proof-of-concept to production, the need for power-efficient, secure, and scalable solutions has become increasingly critical.
Read More: IBM Reveals Processor Innovations to Boost AI Capabilities in Cutting-Edge IBM Z Mainframe Systems