Samsung Electro-Mechanics declared a strategic business partnership with AMD to deliver high-performance substrates for hyper-scale data center computing applications. The collaborative efforts of SEMCO and AMD will optimize the performance and dependency of advanced data centers with robust substrate technology. SEMCO makes these substrates in its technology hub in Busan and the recently developed state-of-art facility in Vietnam. This strategic business alliance between SEMCO and AMD prioritizes addressing the bottlenecks of integrating various semiconductor chips (Chiplets) on one large substrate. For CPU/GPU applications these high-performance substrates are required to provide a significantly huge surface area and more layer counts. It delivers the dense interconnections needed for today’s cutting-edge data centers.
Also Read: DeepL Introduces Next Generation LLM