Samsung Electronics Co., Ltd., a world leader in advanced memory technology, held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — including the cloud, edge devices and automotive vehicles.

Attended by about 600 customers, partners and industry experts, the event served as a platform for Samsung executives to expand on the company’s vision for “Memory Reimagined,” covering long-term plans to continue its memory technology leadership, outlook on market trends and sustainability goals. The company also presented new product innovations such as the HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD.

Jung-Bae Lee, President and Head of Memory Business at Samsung Electronics, used his keynote address to expand on how Samsung will overcome the challenges of the hyperscale era through innovations in new transistor structures and materials. For example, Samsung is currently preparing new 3D structures for sub-10-nanometer (nm) DRAM, allowing larger single-chip capacities that can exceed 100 gigabits (Gb). Following its 12nm-class DRAM that began mass production in May, 2023, Samsung is working on its next-generation 11nm-class DRAM, which is set to offer the industry’s highest density.

Also Read: Quantum Computing Inc. Selects Tempe, Arizona as the Site for its Quantum Photonic Chip Foundry 

NAND flash breakthroughs that will shrink cell sizes and refine channel hole etching techniques are also in development, with the goal of ushering in 1,000-layer vertical NAND (V-NAND). Development is on track for Samsung’s ninth-generation V-NAND to provide the industry’s highest layer count based on a double-stack structure. The company has secured a functional chip for the new V-NAND and plans to start mass production early next year.

“The new era of hyperscale AI has brought the industry to a crossroads where innovation and opportunity intersect, presenting a time with potential for great leaps forward, despite the challenges,” said Lee. “Through endless imagination and relentless perseverance, we will continue our market leadership by driving innovation and collaborating with customers and partners to deliver solutions that expand possibilities.”

SOURCE: Businesswire