Cadence has introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, describing it as the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design. The new solution extends Cadence’s AI portfolio by enabling engineers to move from system planning to manufacturing within a unified AI-native environment. Accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, AuraStack coordinates specialized AI agents across planning, implementation, and multiphysics analysis to automate design workflows, reduce manual iterations, and accelerate design convergence. The platform integrates electrical, thermal, and mechanical analysis-including signal and power integrity, stress, vibration, and fatigue-within a continuous feedback loop to improve product reliability and minimize late-stage design issues. Cadence has partnered with various industry players such as NVIDIA and TSMC to validate the platform for AI infrastructure and complex semiconductor packaging solutions.
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NVIDIA has taken advantage of this tool in optimizing more complex engineering processes. At the same time, TSMC has teamed up with Cadence to fast track multi-die packages using AI automation. The collaboration will help to boost productivity in developing various solutions, including AI, HPC, automotive, aerospace, among others. “The next era of AI infrastructure-spanning data centers, automotive, aerospace and physical AI-will be defined not only by silicon, but by the systems that connect, power and cool it,” said Michael Jackson, corporate vice president of R&D for System Design and Analysis at Cadence. “As hyperscale data centers deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realization.”