The new Vertiv™ SmartIT platform is a pre-engineered AI infrastructure solution based on NVIDIA MGX™ and OCP ORV3 architecture
With the Vertiv™ SmartIT, dry it, and they will come. Digital infrastructure provider Vertiv has launched an architecture for high density AI deployments that leverages factory-validated, pre-engineered components to facilitate high-density AI implementations in brownfield facilities, new deployments, colocation facilities, and hyperscale deployments. Informed by the NVIDIA MGX™ and OCP ORV3 architectures, the all-in-one platform consists of rack infrastructure, direct liquid cooling for the LED, the direct-to-chip cooling distribution units, rack cooling distribution units, and the continuous operation monitoring with integrated leak detection.
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This approach enables customers to tackle multi-vendor coordination risks, accelerate commissioning timeframes, and grow AI clusters-from one rack to hundreds of racks-without requiring a facility rebuild or a complete design overhaul. Scott Armul, chief product and technology officer for Vertiv, said: “Artificial intelligence has increased the pressure on data center facilities to integrate power, cooling, and IT infrastructure in closer granularity as the complexity of workloads continues to grow. Vertiv™ SmartIT is designed to meet that challenge by unifying those design domains in a factory-validated topology. Bringing together Vertiv’s experience across the full end-to-end data center infrastructure stack, we’ll help customers simplify deployment, achieve greater consistency in their AI environments, and establish a platform that can evolve with their compute needs.” Specifically designed for high-performance platforms such as the NVIDIA GB300 NVL72 and the Rubin family of architecture, the solution lives within a wider Vertiv ecosystem alongside Vertiv™ Smart Run rack PDU, Vertiv™ Unify controllers, and Vertiv™ Global Services.
Read More: Vertiv Simplifies High-Density AI Infrastructure Deployment Across Data Center Environments