Amkor Technology, and NVIDIA have finalized a multi-year strategic agreement to co-develop advanced semiconductor packaging and test solutions designed to power next-generation artificial intelligence (AI) and accelerated computing platforms.
As part of the commercial arrangement, NVIDIA will provide a financial prepayment to support the expansion of Amkor’s advanced packaging production capacity within the United States.
Advancing Next-Generation Heterogeneous Integration
Advanced semiconductor packaging serves as an essential technology enabler, driving the system-level performance, power efficiency, and high-density integration required by modern AI architectures. Under the multi-year framework, Amkor and NVIDIA will align their long-term technical roadmaps to accelerate the commercial deployment of critical packaging innovations, including high-density interconnects and advanced heterogeneous integration techniques.
The agreement builds upon Amkor’s established history of delivering high-performance packaging and test solutions across NVIDIA’s hardware ecosystem. This footprint spans high-density data center processors, high-speed networking chipsets, and complex accelerated computing platforms. The deepened collaboration is structured to bring emerging packaging architectures to market at commercial scale as global enterprise demand for AI processing infrastructure continues to accelerate.
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Strengthening U.S. Semiconductor Supply Chain Resilience
The strategic alignment underscores a shared goal to establish robust, full-turnkey packaging and testing capabilities within the domestic supply chain. NVIDIA’s capacity funding directly supports the ongoing buildout of Amkor’s advanced packaging campus in Peoria, Arizona.
By pairing this expanding domestic footprint with Amkor’s existing manufacturing scale across Asia, the two companies are constructing a geographically diversified and resilient global supply chain framework tailored to critical AI infrastructure needs.
“AI is driving a generational shift in technology, transforming every industry and creating a unique opportunity to reinvigorate American manufacturing and supply chains,” said Debora Shoquist, Executive Vice President of Operations at NVIDIA. “Amkor’s global capabilities, combined with their committed investment in the United States, are critical components of building resilient AI infrastructure and accelerating next-generation technologies.”
“This strategic partnership with NVIDIA underscores the central role advanced packaging plays in enabling the future of AI,” said Kevin Engel, chief executive officer of Amkor Technology. “Our agreement with NVIDIA accelerates our long-term roadmap and supports our ability to deliver full turnkey advanced packaging and test solutions, leveraging our global footprint while expanding U.S. capabilities to support critical AI infrastructure.”